Contents: Superconducting electronics, digital photo, and home automation.

 

Olga Kaplounenko

Coherent Inc. 

5100 Patrick Henry Drive

Santa Clara, CA 95054

Phone: (408) 764-4184

E-mail: olga@kapl.addr.com

 

EDUCATION

Moscow Power Institute (Moscow, Russia).

Master of Science in Electrical Engineering, 1987

 

OBJECTIVE

Challenging position in manufacturing management in a growth-oriented organization, which offers diverse job responsibilities.

 

PROFESSIONAL EXPERIENCE

 Coherent, Inc.

 Sr. Mfg. Supervisor (wafer process), March 2002 – present

Responsibilities:

  • Interview and hire technicians and engineers

  • Order clean room supplies

  • Schedule work in the processing area

  • Select material for processing

  • Release work orders in Oracle ERP system and complete them

  • Check final product test results and initiate shipments of the finished goods to customers

  • Maintain and update documentation in wafer processing area

  • Perform inventory transactions, keep accurate inventory count

  • Work on regular basis with the following databases: Lotus Notes, Agile PDM, Oracle ERP

Process Development Engineer, November 1999 – March 2002

Responsibilities:

  • Support all wafer fabrication areas, including Contact Photolithography, Wet Etch, E-beam evaporation, PECVD, Dry Etch (RIE), RTA, develop new processes

  • Design masks for the photolithography

  • Create qualification procedures for all equipment (after preventive maintenance and downtime)

  • Create and maintain Part Number records in several databases

  • Create and maintain documentation: followers, processing instructions

  • Develop and document training procedures, train new personnel

  • Perform laser diode bar inspections in SEM

  • Test laser diode bars, investigate bar performance at different operation settings

  • Purchase lab equipment

Process Technician (wafer process), September 1997 – November 1999

Responsibilities:

  • Work in laser diode fabrication, process GaAs EPI wafers through all processing steps: photolithography, wet etch, dry etch, PECVD, RTA and metallization, backside processing (lapping and chemical polishing).

  • Collect data for SPC

  • Work with processing databases, open work orders.

Equipment used: CEE spinner and hot plate, Karl Suss and OAI mask aligners, RTA, Oxford PECVD and RIE chambers, Temeskal E-beam evaporator, Logitech lapper, Rudolph ellipsometer, KLA-Tencor profilometers.

 Chalmers Technical University, Gothenburg, Sweden

Process Development Engineer (Guest Researcher), October 1994 – May 1995

  • Worked on developing new processes for integrated sub-mm microwave receivers based on S-I-S mixers (joint Swedish-Russian project)

 

NKT Research Center, Glostrop, Denmark

Guest Researcher, July 1993 – August 1993

  • Performed E-beam photolithography on EBM for superconductive microcircuits fabrication

 

Institute of Radio Engineering and Electronics (Russian Academy of Sciences), Moscow, Russia

Junior Scientific Researcher, January 1990 – April 1996

  • Worked on developing of new processes for superconducting chip fabrication on Si, glass and quarts substrates. Performed photolithography, dry etch, lift-off, evaporation and sputtering of different metals and dielectrics.

 State Institute of Oil and Gas Industry, Moscow, Russia

Design engineer, March 1887 – December 1889

  • Designed electrical systems for machinery and illumination of factories and plants in Oil and Gas Industry

 REFERENCES AVAILABLE UPON REQUEST